Programmable control unit.
Programmable control unit.
Basic ventilation unit.
Clean air (passing through the end-filters) distributed to individual rooms
(basic level near to class 10000). Using laminar flow-boxes the air cleaned
further (the final level near to class 100 in the area of lithography for
monolithic structures).
Reversal osmotic cleaner.
Deionization / filter unit.
Description of the DI water system.
Standard barrel plasma etcher.
Used for descuming and stripping
of resists preferrably.
Laboratory planar plasma etcher.
Dry etching of insulating layers
(silicon oxides and nitrides) performed here.
Experimental Reactive Ion Etcher.
Vacuum deposition and etching equipment.
Description of the equipment.
Clean area for resist deposition and processing.
The area for deposition and heat treatment of resists.
The area for wet etching.
Clean area for mask aligners.
Contact aligner (split-field microscope).
Projection (DSW - Direct Step on Wafer) align and exposure system.
Contact aligner (standard microscope).
The area for visual inspection.
Optical reflectometer and four-probe unit.
The diamond dicing saw.
The equipment for assembling and for final visual
inspection
(chip micromanipulator,
LEITZ Ergolux/ICR
microscope,
optical projection microscope,
wire bonders).
Czech
version
